Snapdragon 8 Elite overheating concerns dimmed early excitement for the Galaxy S25 Ultra. The chipset promises significant performance improvements. However, the chip is suspected of excessive heating on the very first model.
Samsung will equip the Galaxy S25 Ultra with Snapdragon 8 Elite, which must avoid having any overheating concerns. The company’s mobile division is doing a great job, but any such hurdle will become a crisis for the entire business.
Snapdragon 8 Elite is being manufactured using TSMC’s 3nm process node. It’s the first Qualcomm chipset that uses cutting-edge process technology. Meanwhile, it could potentially have overheating issues on certain flagship phones.
Snapdragon 8 Elite makes flagship hot?
Realme GT7 Pro is powered by Snapdragon 8 Elite processor. Reviewers praised its solid performance and stability, but, it could have a potential issue of excessive overheating in certain circumstances.
Reviewers at AndroidAuthority and DigitalTrends observed an overheating problem on the Realme GT7 Pro running Snapdragon 8 Elite. The software issued a notification that the handset was running so warm during benchmarking.
Notably, the Realme GT7 Pro has a solid cooling mechanism, packing a huge vapor chamber. Despite this, the phone reached significant warm conditions, leading the software to pop up notice that the “phone running so warm.”
Will it shatter Galaxy S25 Ultra supremacy?
Nowadays, performance and efficiency are the scale of a chipset. Consumers won’t prefer an exceptionally powerful processor without solid power efficiency. Power efficiency alone is not acceptable unless it features decent performance.
Samsung is all set to make the Galaxy S25 Ultra stand out from rivals such as iPhone 15 Pro Max. Apple is using 2nd-gen 3nm chipset in the latest iPhone Pro models. Hence, any overheating concern would put Samsung in massive trouble.
The Korean tech giant is said to pack the next flagship with an improved cooling tech. Oryon CPU brings exceptional performance, but efficiency can be achieved with an equivalent approach from the software and cooling mechanism end.
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